JUPITER DESIGN TECHNOLOGIES PVT. LTD.
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High Speed BGA Technology
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Product Code : 02

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Product Specification
Our years of industrial experience and superior technology allow us to design and development of high speed BGA technology. For the designing we use following technologies:
  • Blind and Buried via Technology
  • Micro via Technology
  • "Bookbinder” Rigid-Flex Technology
  • SMT and BGA Technology
  • Backplane Technology
  • RF and Microwave Technology
Some of the salient features of our high speed BGA technology are as follows:
  • Rigid up to 40 layers
  • Flex and rigid-flex up to 28 layers
  • Metal core boards: Copper, Aluminum, Copper Invar Copper
  • Boards with heave sinks: Copper and Aluminum (2D or 3D)
Specifications:
  • MIL-PRF-55110 Type 2- for GY
  • MIL-PRF-55100 Type-3- for GF, GI, GM, BI, RO 4003
  • Mil-P50884 Type-4 ¿ for rigid-flex (adhesive and adhesive-less)
  • UL approval 94-V-0- for double sided, Multi-layers and rigid-flex, AP and Adhesive-less based product.
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CONTACT DETAILS
#430, 11th Main, Vivek Nagar,Bangalore - 560047, Karnataka, India
Phone:91-80-25714052
Fax:91-80-25701777
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Key Personnel
Mr. V. Lokanath (Senior Member)
Mobile:+919845173691

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