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Mixed Signal Board We use latest technology in the design and development of mixed signal boards. Some of the technology we utilize in the designing comprises of the following:
- Blind and Buried via Technology
- Micro via Technology
- Bookbinder Rigid Flex Technology
- SMT and BGA Technology
- Backplane Technology
- RF and Microwave Technology
Some of the salient features of our mixed signal boards are as follows:
- Rigid up to 40 layers
- Flex and rigid-flex up to 28 layers
- Metal core boards: Copper, Aluminum, Copper Invar Copper
- Boards with heave sinks: Copper and Aluminum (2D or 3D)
Specifications:
- MIL-PRF-55110 Type 2- for GY
- MIL-PRF-55100 Type-3- for GF, GI, GM, BI, RO 4003
- Mil-P50884 Type-4 ¿ for rigid-flex (adhesive and adhesive-less)
- UL approval 94-V-0- for double sided, Multi-layers and rigid-flex, AP and Adhesive-less based product
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